Digital Image Processing: Automated X-Ray Inspection in Electronics Manufacturing
نویسنده
چکیده
In this paper, we examine two dimensional transmission and three dimensional laminography, as implemented in two Automated X-Ray Inspection (AXI) industrial machines used for inspection of Surface Mount Technology (SMT) solder joint connections in electronics manufacturing: the Teradyne XStation and Agilent 5DX. Factors affecting xray image quality, such as the size of the focal spot, the x-ray source spectrum and energy absorption in the target material are described. This report is also available at [http://www.cs.dal.ca/ ∼boardman].
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